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Rapidus Corporation, Japan’s semiconductor hope, starts prototyping next-generation chips at its IIM-1 plant. Full-scale mass production is expected to begin by 2027, boosting Japan’s global chip competitiveness.
Japan’s Rapidus Corporation, the government-backed semiconductor venture, has officially begun prototyping next-generation logic chips at its IIM-1 (Innovative Integration for Manufacturing) facility. Located in Chitose, Hokkaido, the IIM-1 fab is a crucial part of Japan’s strategy to revive its position in the global semiconductor market, long dominated by Taiwan, South Korea, and the United States.
According to the company’s recent announcement, mass production is expected to begin in 2027, making Rapidus one of the most closely watched chip ventures in Asia.
A Strategic Leap for Japan’s Semiconductor Industry
Japan was once a dominant force in the global semiconductor landscape, but over the last two decades, it ceded ground to international competitors. With Rapidus, Japan aims to reclaim its technological edge, particularly in advanced logic chips below the 2-nanometer node.
Backed by heavy investments from the Japanese government and strategic partnerships with tech giants like IBM and IMEC, Rapidus is focused on developing chips for AI, high-performance computing (HPC), and 6G communications.
The prototyping stage at IIM-1 signifies a major milestone for the company. This phase will allow Rapidus to test designs, materials, and production methodologies before scaling to commercial-level manufacturing.
Collaboration with Global Leaders
One of the key strengths behind Rapidus’ progress is its global collaboration model. The company has partnered with IBM, which previously announced the world’s first successful demonstration of a 2nm chip. IBM is providing Rapidus with the know-how and intellectual property needed to shorten the development timeline.
In addition, Rapidus is working closely with IMEC, a European nanoelectronics research center known for its cutting-edge semiconductor R&D. These partnerships ensure that Rapidus isn’t starting from scratch—it’s leveraging decades of global expertise to fast-track its roadmap.
IIM-1: Japan’s First Advanced Logic Fab
The IIM-1 fab in Hokkaido is being built as Japan’s first advanced logic semiconductor fabrication facility. It represents the centerpiece of the country’s ambition to localize production of next-gen chips while maintaining global standards of excellence.
The facility is expected to support extreme ultraviolet (EUV) lithography, a technology critical for producing chips at the 2nm scale. Japan’s domestic toolmakers and materials suppliers, such as Tokyo Electron and JSR Corporation, are also expected to play major roles in the supply chain.
Future Outlook: Global Competitiveness by 2030
With prototyping now underway and a clear roadmap to mass production by 2027, Rapidus is positioning itself as a formidable player in the global semiconductor industry. The company’s long-term vision aligns with Japan’s goal to produce 20% of the world’s advanced chips by 2030.
If successful, Rapidus will not only help secure supply chains for critical technologies but also revitalize Japan’s economy and innovation leadership in the tech sector.
Keywords:
Rapidus chip production, Japan semiconductor industry, IIM-1 fab Hokkaido, 2nm chip Japan, Rapidus IBM partnership, next-gen chip prototyping, advanced logic chips, EUV chip manufacturing, Japan chip mass production 2027
